Electronic package and method for manufacturing the same
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYing-Chang Tseng, Yuan-Hung Hsu, Chang-Fu Lin
Life of this patent
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Abstract
This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.
Claims22
An electronic package, comprising:
- a first substrate including an antenna structure and at least one limiter provided at an edge of the first substrate;
- a second substrate including one or more circuit layers, the first substrate being stacked on top of the second substrate via a plurality of conductive components;
- and
- at least a support body formed between the first substrate and the second substrate and extending to be in contact with the limiter to hold the first substrate and the second substrate in place, wherein the support body is free from being electrically connected with the first substrate and the second substrate.
A method for manufacturing an electronic package, comprising:
- providing a first substrate including an antenna structure and at least one limiter provided at an edge of the first substrate;
- stacking the first substrate on top of a second substrate having circuit layers via a plurality of conductive components;
- and
- forming between the first substrate and the second substrate at least a support body extending to be in contact with the limiter to hold the first substrate and the second substrate in place, wherein the support body is free from being electrically connected with the first substrate and the second substrate.
Dependencies are inferred from the claim text.