Printing device and printing method
AssigneeFuji Corporation
InventorsMinoru KINUTA, Shoji FUKAKUSA, Kento ASAOKA
Life of this patent
Estimating the term…
Loading patent…
AssigneeFuji Corporation
InventorsMinoru KINUTA, Shoji FUKAKUSA, Kento ASAOKA
Estimating the term…
A solder paste printer for which a pressing force of squeegee 62 towards a stencil when spreading solder paste 110, that is, a printing pressure, is smaller than a printing pressure when performing solder paste printing. The force with which the solder paste is pressed downwards by the squeegee is weak, and instead of solder paste being pressed down, it spreads along the squeegee. Also, the moving speed of the squeegee when spreading the solder paste is faster than the moving speed of the squeegee when printing solder paste. Thus, because the squeegee is moving fast, before the solder paste is pressed down sufficiently to be printed, the solder paste spreads out along the squeegee. Accordingly, it is possible to appropriately spread the solder paste along the direction in which the squeegee extends.
A printing device comprising:
A printing device comprising:
A printing method of printing a viscous material onto a board that is closely contacting a lower surface of a stencil using a printing device that includes a squeegee configured to slide on an upper surface of the stencil in which through-holes are formed and a moving device configured to move the squeegee back and forth along a specified direction, the printing method comprising:
A printing method of printing a viscous material onto a board that is closely contacting a lower surface of a stencil using a printing device that includes a squeegee configured to slide on an upper surface of a stencil in which through-holes are formed and a moving device configured to move the squeegee back and forth along a specified direction, the printing method comprising:
Dependencies are inferred from the claim text.