Composite electronic component and board having the same

A composite electronic component comprising a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other,

• the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and
• the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material containing alumina (Al2O3),
• wherein T/L≥0.22 in which L is a length L of the multilayer ceramic capacitor and T is a thickness of the ceramic chip, and
• wherein a width of the ceramic chip is wider than that of the multilayer ceramic capacitor.

A composite electronic component comprising a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other,

• the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body containing alumina (Al2O3), and
• the ceramic chip being disposed on a lower surface of the multilayer ceramic capacitor and including a second ceramic body formed of a ceramic material containing alumina (Al2O3),
• wherein the internal electrodes are stacked to be perpendicular to the lower surface of the multilayer ceramic capacitor,
• wherein T/L≥0.12 in which L is a length L of the multilayer ceramic capacitor and T is a thickness of the ceramic chip, and
• wherein a length of the ceramic chip is longer than that of the multilayer ceramic capacitor.