Printed circuit board including warpage offset regions and semiconductor packages including the same

A printed circuit board divided into first to ninth regions in a three by three array, the printed circuit board comprising:

• a base layer comprising a first surface and a second surface opposite to each other;
• a first routing layer comprising a plurality of first lines on the first surface;
• and
• a second routing layer comprising a plurality of second lines on the second surface, wherein
• an upper part of each of the first, third, seventh and ninth regions is defined as a first deformation region,
• an upper part of each of the second, fourth, sixth and eighth regions is defined as a second deformation region,
• a lower part of each of the first, third, seventh and ninth regions is defined as a third deformation region,
• a lower part of each of the second, fourth, sixth and eighth regions is defined as a fourth deformation region,
• an area ratio of an area of first lines in the first deformation region to an area of the first deformation region is less than an area ratio of the first lines in the second deformation region to an area of the second deformation region, and
• an area ratio of an area of the second lines in the third deformation region to the area of the third deformation region is greater than an area ratio of an area of the second lines in the fourth deformation region to the area of the fourth deformation region.

A semiconductor package, comprising a lower package, an upper package and a printed circuit board between the lower and upper packages,

• wherein each of the lower package and the upper package comprises a package substrate, and a semiconductor chip mounted on the package substrate,
• wherein the printed circuit board is divided into first to ninth regions in a three by three array,
• wherein the printed circuit board comprises:
• a base layer having a first surface and a second surface opposite to each other;
• a first routing layer comprising a plurality of first lines on the first surface;
• and
• a second routing layer comprising a plurality of second lines on the second surface, wherein
• an upper part of each of the first, third, seventh and ninth regions is defined as a first deformation region,
• an upper part of each of the second, fourth, sixth and eighth regions is defined as a second deformation region,
• a lower part of each of the first, third, seventh and ninth regions is defined as a third deformation region,
• a lower part of each of the second, fourth, sixth and eighth regions is defined as a fourth deformation region,
• an area ratio of an area of the first lines in the first deformation region to area of the first deformation region is less than an area ratio of an area of the second lines in the third deformation region to the area of the third deformation region, and
• an area ratio of an area of the first lines in the second deformation region to an area of the second deformation region is greater than an area ratio of an area of the second lines in the fourth deformation region to an area of the fourth deformation region.