Flexible and conformal electronics using rigid substrates
AssigneeBrigham Young University (BYU)
InventorsBryce Parker DEFIGUEIREDO, Spencer Magleby, Larry Howell
Life of this patent
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Abstract
A flexible electronics assembly includes a single-piece substrate having two regions of rigidity separated by a localized region of flexibility. The localized region of flexibility has a lower rigidity than the two regions of rigidity. The two regions of rigidity are angularly deflectable from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate by hinging action of the localized region of flexibility. At least one electronic component is mounted on at least one of the two regions of rigidity.
Claims20
A method, comprising:
- geometrically modifying a single-piece substrate to include two regions of rigidity separated by a localized region of flexibility, the localized region of flexibility having a lower rigidity than the two regions of rigidity, the localized region of flexibility including a plurality of compliant joints, the plurality of compliant joints including at least a lamina emergent torsional (LET) joint;
- and
- angularly deflecting, repeatedly, the two regions of rigidity from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate, and from the non-planar configuration of the single-piece substrate to the planar configuration of the single-piece substrate
A method, comprising:
- forming a localized region of flexibility separating two regions of rigidity in a printed circuit board, the localized region of flexibility having a lower rigidity than the two regions of rigidity, the localized region of flexibility separating the two regions of rigidity, the localized region of flexibility including a plurality of compliant joints, the plurality of compliant joints including at least a lamina emergent torsional (LET) joint and forming a hinge configured to angularly deflect the two regions of rigidity, repeatedly:
- from a planar configuration of the printed circuit board to a non-planar configuration of the printed circuit board;
- and
- from the non-planar configuration of the printed circuit board to the planar configuration of the printed circuit board,
- at least one of the two regions of rigidity of the printed circuit board is configured to receive an electronic device component mounted thereon.
A method, comprising:
- geometrically modifying a single-piece substrate to include a localized region of flexibility separating two regions of rigidity, the localized region of flexibility having a lower rigidity than the two regions of rigidity;
- and
- configuring the localized region of flexibility separating the two regions of rigidity as a hinge to angularly deflect the two regions of rigidity, repeatedly, by more than 90° from a planar configuration of the single-piece substrate to a non-planar configuration of the single-piece substrate.
Dependencies are inferred from the claim text.