Printed Circuit Board and Method for Producing Same

2:

• The method according to claim 1, wherein the preparing of the flexible board comprises:
• preparing a flexible base substrate;
• forming a first via hole in a flexible region of the flexible base substrate;
• forming a plating layer by plating one surface of the flexible base substrate and an inside wall surface of the first via hole;
• etching the plating layer to form an internal circuit pattern;
• and
• forming a protective layer to cover the internal circuit pattern.

4:

• The method according to claim 1, wherein the laminating comprises:
• forming a second via hole within the rigid region of the flexible board;
• filling the second via hole formed in the flexible board with a conductive material;
• forming a second via hole in the cured base substrate;
• filling the second via hole formed in the cured base substrate with a conductive material;
• laminating the cured base substrate on the rigid region of the flexible board;
• and
• forming an external circuit pattern on one surface of the cured base substrate laminated on the flexible board.

6:

• The method according to claim 1, wherein the laminating comprises:
• stacking the cured base substrate on the rigid region of the flexible board;
• forming a second via hole passing through the cured base substrate and the flexible board in a direction of thickness;
• filling the second via hole formed to pass the cured base substrate and the flexible board with conductive material;
• and
• forming an external circuit pattern on one surface of the cured base substrate.

7:

• A printed circuit board comprising:
• a flexible board including a flexible region and a rigid region and provided with an internal circuit pattern formed thereon;
• a cured base substrate with an external circuit pattern formed on one surface thereof, the cured base substrate being laminated on the rigid region of the flexible board;
• and
• a second via hole formed in the flexible board and the cured base substrate, filled with a conductive material, and connected to the internal circuit pattern and the external circuit pattern.

8:

• The printed circuit board according to claim 7, wherein the flexible board comprises:
• a flexible base substrate;
• a first via hole formed within the flexible region of the flexible board in a manner to pass through the flexible region in a thickness direction;
• the internal circuit pattern formed on a first surface and a second surface of the flexible base substrate and on an inside wall surface of the first via hole;
• and
• a protective layer formed on the internal circuit pattern.

13:

• The printed circuit board according to claim 7, wherein the flexible board comprises:
• a flexible base substrate;
• and an adhesive layer formed on one surface of the flexible base substrate, and
• wherein an adhesion temperature at which the adhesive layer adheres is set to be lower than a processing temperature at which the flexible base substrate is processed.