Printed Circuit Board with Routing of a Conductor and Dielectric Strands
AssigneeInternational Business Machines Corporation
InventorsYanyan Zhang, Lloyd Andre Walls, Jinwoo Choi, Mehdi Mohamed Mechaik
Life of this patent
Estimating the term…
Abstract
Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer is comprised of a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor having a matching orientation and separation distance from a source to a destination.
Claims18
A method of producing a printed circuit board, comprising:
- forming a first layer comprising a first dielectric material and positioning a first ground conductive layer in communication with the first dielectric material;
- forming an intermediate layer positioned between and separated from the first dielectric material and a second dielectric material, the separation forming an opening between the first and second dielectric material, the intermediate layer comprising:
- a conductor, a first fiberglass material, and a second fiberglass material;
- and
- positioning the conductor in the formed intermediate layer proximal to the first and second fiberglass materials.
A method of producing a printed circuit board, comprising:
- forming a first layer comprising a first dielectric material and positioning a first ground conductive layer in communication with the first dielectric material;
- forming a second layer positioned between and separated from the first dielectric material, the separation forming an opening with the first dielectric material, the second layer comprising:
- a conductor and a first fiberglass material;
- and
- positioning the conductor in the formed second layer proximal to the first fiberglass material.
Dependencies are inferred from the claim text.