Transducer vibrating diaphragm structure, flat panel speaker and earphone therewith
OwnerFang Bianinventor
Life of this patent
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Abstract
An earphone comprising a transducer vibrating diaphragm structure is described herein. The transducer vibrating diaphragm structure comprises a diaphragm including a first surface and a second surface opposite the first surface, a first frame and a second frame disposed at two sides of the diaphragm and coupled to a periphery of the diaphragm, a first magnetic element and a second magnetic element disposed to correspond to the first surface and the second surface, respectively. A total area of the diaphragm is less than or equal to 120 square millimeters and a sensitivity of the diaphragm is greater than 105 dB.
Claims20
A transducer vibrating diaphragm structure, comprising:
- a diaphragm comprising a first surface and a second surface opposite the first surface, wherein a first coil circuit is provided on the first surface of the diaphragm via vapor deposition or liquid deposition, wherein the first coil circuit is formed of a conductive material, wherein a total area of the diaphragm is less than or equal to 120 square millimeters, and wherein a sensitivity of the diaphragm is greater than 105 dB;
- a first frame and a second frame disposed at two sides of the diaphragm corresponding to the first surface and the second surface, respectively, wherein a periphery of the diaphragm is coupled to the first frame and the second frame;
- and
- a first magnetic element and a second magnetic element disposed to correspond to the first surface and the second surface, respectively, wherein the first magnetic element and the second magnetic are provided on a third frame and a fourth frame, respectively.
A flat panel speaker, comprising:
- a transducer vibrating diaphragm structure, wherein the transducer vibrating diaphragm structure comprises:
- a diaphragm comprising a first surface and a second surface opposite the first surface, wherein a first coil circuit is provided on the first surface of the diaphragm via vapor deposition or liquid deposition, wherein the first coil circuit is formed of a conductive material, wherein a total area of the diaphragm is less than or equal to 120 square millimeters, and wherein a sensitivity of the diaphragm is greater than 105 dB,
- a first frame and a second frame disposed at two sides of the diaphragm corresponding to the first surface and the second surface, respectively, wherein a periphery of the diaphragm is coupled to the first frame and the second frame, and
- a first magnetic element and a second magnetic element disposed to correspond to the first surface and the second surface, respectively, wherein the first magnetic element and the second magnetic are provided on a third frame and a fourth frame, respectively;
- and
- a support frame configured to provide a rigid support to the transducer vibrating diaphragm structure, the transducer vibrating diaphragm structure being mounted on the support frame.
An earphone, comprising:
- a transducer vibrating diaphragm structure, wherein the transducer vibrating diaphragm structure comprises:
- a diaphragm comprising a first surface and a second surface opposite the first surface, wherein a first coil circuit is provided on the first surface of the diaphragm via vapor deposition or liquid deposition, wherein the first coil circuit is formed of a conductive material, wherein a total area of the diaphragm is less than or equal to 120 square millimeters, and wherein a sensitivity of the diaphragm is greater than 105 dB,
- a first frame and a second frame disposed at two sides of the diaphragm corresponding to the first surface and the second surface, respectively, wherein a periphery of the diaphragm is coupled to the first frame and the second frame, and
- a first magnetic element and a second magnetic element disposed to correspond to the first surface and the second surface, respectively, wherein the first magnetic element and the second magnetic are provided on a third frame and a fourth frame, respectively;
- and
- a housing configured to contain the transducer vibrating diaphragm structure.
Dependencies are inferred from the claim text.