Optical transmission device, method for manufacturing same, and optical transmission module
AssigneeKabushiki Kaisha Toshiba
InventorHideto FURUYAMA
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a via holds an optical fiber and has an opening in at least a first surface of a silicon substrate. An interconnect is provided at a second surface of the silicon substrate and connected to an optical semiconductor element. Side-surface electrodes are provided at a third surface of the silicon substrate. The third surface is other than the first surface and the second surface of the silicon substrate. At least a portion of the side-surface electrodes is connected to the interconnect. At least a portion of the side-surface electrodes have different lengths along the third surface.
Claims11
An optical transmission device, comprising:
- a via holding an optical fiber and having an opening in at least a first surface of a silicon substrate;
- at least one optical semiconductor element, the optical semiconductor element being provided on a second surface of the silicon substrate opposing the first surface in a region where the via holding the optical fiber is formed, or the optical semiconductor element being provided on the via holding the optical fiber on the second surface side of the silicon substrate opposing the first surface;
- an interconnect provided at the second surface of the silicon substrate and connected to the optical semiconductor element;
- and
- a plurality of side-surface electrodes provided at a third surface of the silicon substrate, the third surface being other than the first surface and the second surface of the silicon substrate, at least a portion of the plurality of side-surface electrodes being connected to the interconnect,
- at least a portion of the plurality of side-surface electrodes having different lengths along the third surface.
An optical transmission device, comprising:
- a silicon substrate having an optical element surface, a side surface, and a via extending toward the optical element surface from a surface on a side opposite to the optical element surface;
- an optical element provided at the optical element surface;
- a plurality of side-surface electrodes provided at the side surface, the side-surface electrodes including a first side-surface electrode and a second side-surface electrode, a length in a direction along the side surface of the first side-surface electrode being different from a length in the direction along the side surface of the second side-surface electrode;
- and
- an interconnect provided at the optical element surface, the interconnect electrically connecting the optical element and at least a portion of the side-surface electrodes.
A method for manufacturing an optical transmission device, comprising:
- forming an optical element at a first major surface of a silicon substrate;
- forming a plurality of blind vias arranged along a first direction in the silicon substrate, the blind vias having openings at the first major surface and including a first blind via and a second blind via, a depth of the second blind via being different from a depth of the first blind via;
- forming an electrode inside the blind vias;
- forming an interconnect at the first major surface, the interconnect connecting the electrode and the optical element;
- and
- dividing the electrode inside the blind vias in a second direction orthogonal to the first direction by cutting the silicon substrate along the first direction at a position where the blind vias are arranged.
Dependencies are inferred from the claim text.