Semiconductor device and method of manufacturing semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsYuichiro HINATA, Tatsuo NISHIZAWA
Life of this patent
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Abstract
A semiconductor device includes: an insulation circuit substrate including a metal layer and an insulation substrate, the metal layer being formed on one surface of the insulation substrate, a connecting member having a cylindrical shape joined to the metal layer via a bonding material, a terminal pin inserted in the connecting member, and a reinforcement member having a cylindrical shape disposed on an outer periphery of the connecting member. The reinforcement member is made of a material having a hardness greater than that of the connecting member.
Claims16
A semiconductor device, comprising:
- an insulation circuit substrate including an insulation substrate and a metal layer, the metal layer being provided on one surface of the insulation substrate;
- a connecting member having a cylindrical shape, joined to the metal layer via a bonding material;
- a terminal pin inserted in the connecting member;
- and
- a reinforcement member having a cylindrical shape, disposed on an outer periphery of the connecting member, the reinforcement member being made of a material having a hardness greater than a hardness of a material of the connecting member.
A method of manufacturing a semiconductor device, comprising:
- preparing an insulation circuit substrate including an insulation substrate, and a metal layer formed on the insulation substrate;
- preparing a terminal pin;
- preparing a connecting member having a cylindrical shape;
- preparing a reinforcement member having a cylindrical shape, and being made of a material having a hardness greater than a hardness of the connecting member;
- fitting the reinforcement member to an outer periphery of the connecting member;
- disposing the connecting member to which the reinforcement member is fitted, on the metal layer via a bonding material;
- fixedly joining the connecting member to the metal layer by heating and melting the bonding material and then cooling and solidifying the bonding material;
- and
- press-fitting the terminal pin to the connecting member.
A method of manufacturing a semiconductor device, comprising:
- preparing an insulation circuit substrate in which a metal layer is formed on one surface of an insulation substrate;
- preparing a terminal pin;
- preparing a connecting member having a cylindrical shape;
- preparing a reinforcement member having a cylindrical shape, and being made of a material having a hardness greater than a hardness of the connecting member;
- disposing the connecting member on the metal layer via a bonding material;
- fixedly joining the connecting member to the metal layer by heating and melting the bonding material and then cooling and solidifying the bonding material;
- inserting the terminal pin to the connecting member fixed to the metal layer;
- and
- press-fitting the reinforcement member to an outer periphery of the connecting member.
Dependencies are inferred from the claim text.