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US 2020/0091623 A1Published application
Crimp Interconnect Device, Crimped Arrangement and Method for Making a Crimped Arrangement
AssigneeTDK Electronics Co., Ltd.
InventorSzabolcs Zseli
Life of this patent
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Abstract
A crimp interconnect device, a crimped arrangement and a method for making a crimped arrangement are disclosed. In an embodiment a crimp interconnect device includes a deformable barrel body having an inner side and an outer side and a first material, and a second material that is softer than the first material, wherein the second material is arranged on the inner side.
Claims17
1-15. (canceled)
A crimp interconnect device comprising:
- a deformable barrel body comprising an inner side and an outer side and a first material;
- and
- a second material that is softer than the first material,
- wherein the second material is arranged on the inner side.
1 more element
A crimped arrangement comprising:
- a crimp interconnect device comprising:
- a deformable barrel body having an inner side and an outer side and being made of a first material;
- and
- a second material that is softer than the first material, the second material being arranged on the inner side,
- wherein the crimp interconnect device is crimped to a plurality of conductors, the plurality of conductors comprising at least one conductor made of a third material and at least one conductor made of a fourth material differing from the third material, and
- wherein the second material is tin with a width of 1-2 mm on the inner side.
3 more elements
Dependencies are inferred from the claim text.