Antenna-integrated radio frequency module
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsHong In KIM, Thomas A. KIM, Ho Kyung KANG
Life of this patent
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Abstract
An antenna-integrated radio frequency (RF) module includes a multilayer substrate disposed between an integrated chip (IC) and patch antennas, signal vias, and ground members. The IC is configured to generate RF signals. The signal vias are configured to connect and transmit/receive the RF signals from each of the patch antennas to the IC. The ground members are disposed on an outer surface layer and intermediate surface layers of the multilayer substrate to surround each of the patch antennas and the signal vias.
Claims21
An antenna-integrated radio frequency (RF) module, comprising:
- a multilayer substrate;
- an integrated chip (IC) disposed on an outer surface of the multilayer substrate;
- an RF line disposed on a layer of the multilayer substrate;
- an IC signal via electrically connected between the IC and the RF line;
- an antenna disposed on an antenna layer of the multilayer substrate;
- a first antenna ground member comprising an antenna penetration region surrounding the antenna;
- a first intermediate ground member comprising a first via penetration region;
- a second intermediate ground member surrounding the RF line;
- an antenna signal via electrically connected to the RF line, and disposed to penetrate the first via penetration region;
- and
- ground vias electrically connected to at least one of the first and second intermediate ground members, and disposed surrounding the RF line.
An antenna-integrated radio frequency (RF) module, comprising:
- a multilayer substrate;
- an integrated chip (IC) disposed on an outer surface of the multilayer substrate;
- RF lines disposed on a line layer of the multilayer substrate;
- IC signal vias electrically connected between the IC and the RF lines;
- antennas disposed on an antenna layer of the multilayer substrate;
- an intermediate ground member comprising first via penetration regions;
- a first antenna ground member comprising antenna penetration regions surrounding each of the antennas;
- antenna signal vias electrically connected to the RF lines, and disposed to penetrate the first via penetration regions;
- and
- antenna ground vias electrically connected between the first antenna ground member and the intermediate ground member, and disposed around boundaries of the antenna penetration regions.
An antenna-integrated radio frequency (RF) module, comprising:
- a multilayer substrate;
- an IC signal via extending between layers of the multilayer substrate and configured to be connected to an integrated chip (IC);
- an RF signal line disposed on a layer of the multilayer substrate comprising a first electrical connection to the IC signal via and a second electrical connection to an antenna signal via spaced apart from the first electrical connection;
- an antenna disposed on an antenna layer of the multilayer substrate coupled to the antenna signal via;
- a first intermediate ground member comprising a first penetration region and disposed on another layer of the multilayer substrate, wherein the antenna signal via extends through the first penetration region;
- and
- a first ground via group electrically connected to the first intermediate ground member and disposed to surround the first penetration region,
- wherein the first intermediate ground member overlaps the first connection and the first penetration region overlaps the second connection in a view perpendicular to the layer.
Dependencies are inferred from the claim text.