Sputtered sip antenna
AssigneeAnalog Devices Global Unlimited Company
InventorRomulo Maggay
Life of this patent
Estimating the term…
Abstract
System in package (SIP) modules are compact packages that include components such as processors, memory, sensors, and passive components on a single substrate. One low cost and compact way to integrate an antenna into a SIP module is to suspend an antenna in molding compound so that the antenna is embedded in the real estate of the molding compound layer. To embed the antenna, the molding compound is first deposited. A cavity can be cut in the molding compound to hold the antenna. The cavity can be filled with conductive material to form the antenna. Further molding compound can be deposited to cover the antenna and enclose the antenna in the molding compound layer. Ground structures can also be suspended in the molding compound. Such an embedded antenna can be particularly useful for radio applications.
Claims20
A system in package module, comprising:
- a substrate;
- a component layer;
- one or more components mounted on the component layer;
- one or more molding compound layers;
- and
- an antenna connected to the component layer and enclosed by the one or more molding compound layers.
A method to embed an antenna in a system in package module, comprising:
- cutting a cavity in at least a layer formed by a package molding compound, wherein the cavity extends to a component layer;
- filling the cavity with conductive material to form an antenna;
- and
- depositing further package molding compound over the antenna.
A method to embed an antenna in a system in package module, comprising:
- depositing molding compound;
- cutting one or more cavities in a layer formed by the molding compound;
- filling the one or more cavities with conductive material to form one or more antenna ground structures;
- and
- depositing further molding compound over the one or more antenna ground structures.
Dependencies are inferred from the claim text.