An OLED device comprising a substrate and an OLED element formed on the substrate, wherein, an OLED thin-film encapsulation structure is formed on the OLED element, the OLED thin-film encapsulation structure comprising:
- a first inorganic material layer covered the OLED element positioned on a substrate;
- a first organic material layer deposited on the first inorganic material layer by PECVD process;
- a second organic material layer deposited on the first organic material layer by IJP process;
- and
- a second inorganic material layer deposited on the second organic material layer.