Method of manufacturing light emitting device and light emitting device

A light emitting device comprising:

• a molded package comprising:
• leads including a pair of a first lead and a second lead;
• a molded resin;
• and
• a recess, wherein an upper surface of the leads is partially exposed from a bottom surface of the recess;
• a light emitting component mounted on the bottom surface of the recess;
• and
• at least one sealing member located in the recess to cover the light emitting component,
• wherein at least one of the first lead and the second lead has a groove on an upper surface of the at least one of the first lead and the second lead, the groove being positioned so as to correspond to a corner on the bottom surface of the recess of the mold package in a cross sectional view,
• wherein a portion of the molded resin located within the groove is exposed from the bottom surface of the recess,
• wherein a surface of the corner of the recess is composed of a curved surface, and
• wherein the sealing member covers the corner of the recess.