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US 2020/0091386 A1Published application
Light-emitting structure alignment preservation in display fabrication
AssigneeFacebook Technologies, LLC
InventorOscar TORRENTS ABAD
Life of this patent
Estimating the term…
Abstract
Techniques are disclosed for forming a frame on the backplane comprising structures at least partially circumscribing or enclosing metal contacts on the backplane. In some embodiments, the frame may comprise a photoresist. The dimensions and structural integrity of the frame can help prevent misalignment and/or damage of physical obtrusions of light-emitting structures during a bonding process of the light-emitting structures to the backplane.
Claims20
A method of manufacturing a display, the method comprising:
- providing a backplane comprising:
- a planar surface;
- a first set of electrical contacts coupled to the planar surface;
- and
- one or more frame structures coupled to the planar surface, the one or more frame structures at least partially enclosing the first set of electrical contacts and configured to restrict movement of at least a portion of a light-emitting structure during bonding of the light-emitting structure to the backplane;
- obtaining the light-emitting structure, the light-emitting structure comprising:
- a semiconductor element with a contact surface;
- and
- a second set of electrical contacts coupled to the contact surface;
- placing the light-emitting structure on the backplane such that each electrical contact of the second set of electrical contacts is in physical contact with a respective electrical contact of the first set of electrical contacts;
- and
- bonding the light-emitting structure to the backplane, the bonding comprising:
- heating the light-emitting structure and the backplane;
- and
- applying a force to press the light-emitting structure to the backplane.
12 more elements
A backplane comprising:
- a planar surface;
- a first set of electrical contacts coupled to the planar surface;
- and
- one or more frame structures on the surface of the backplane at least partially enclosing the first set of electrical contacts and configured to, during a bonding process in which each electrical contact of a second set of electrical contacts comprising one or more contacts of a light-emitting structure is bonded with a respective electrical contact of the first set of contacts, come in physical contact with a surface of a semiconductor element of the light-emitting structure.
1 more element
Dependencies are inferred from the claim text.