Chip package and chip thereof
AssigneeChipbond Technology Corporation
InventorsChin-Tang Hsieh, Cheng-Hung Shih
Life of this patent
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Abstract
A microchip is electrically connected to a substrate to become a chip package, preferably for LED. A chip of the package includes a body and at least one electrode which is disposed and exposed on a surface of the body. The electrode includes a confining groove and a confining wall. The confining wall is peripherally located around the confining groove and provided to confine at least one conductive particle of an adhesive in the confining groove. The electrode of the chip is electrically connected to a bonding pad of a substrate via the conductive particle confined in the confining groove.
Claims20
A chip package, comprising:
- a substrate;
- a chip including a body and a first electrode, the first electrode is disposed and exposed on a surface of the body and includes a first confining groove and a first confining wall, the first confining wall is peripherally located around the first confining groove and has a first height;
- and
- an adhesive disposed between the substrate and the chip, at least one first conductive particle of the adhesive is confined in the first confining groove by the first confining wall, wherein the first height of the first confining wall is not higher than a diameter of the at least one first conductive particle, and the first electrode of the chip is electrically connected to a first bonding pad of the substrate by the at least one first conductive particle in the first confining groove.
A chip, comprising:
- a body;
- and
- a first electrode disposed and exposed on a surface of the body, the first electrode includes a first confining groove and a first confining wall which is peripherally located around the first confining groove and has a first height, wherein the first confining wall is provided to confine at least one conductive particle of an adhesive in the first confining groove, and the first height of the first confining wall is not higher than a diameter of the at least one conductive particle.
A chip, comprising:
- a body;
- and
- a electrode exposed on a surface of the body and including a confining groove and a confining wall, the confining wall is peripherally located around the confining groove and provided to confine at least one conductive particle in the confining groove.
Dependencies are inferred from the claim text.