Photocoupler

A photocoupler comprising:

• an insulating substrate including an upper surface, a first side surface, and a second side surface on opposite side of the first side surface;
• a semiconductor light receiving element provided on the upper surface of the insulating substrate and including a light receiving region, a first electrode, and a second electrode on its upper surface;
• a semiconductor light emitting element provided on the light receiving region, including a first electrode and a second electrode on its upper surface, and emitting emission light toward the light receiving region;
• an input terminal including a first conductive region and a second conductive region, the first conductive region being connected to the first electrode of the semiconductor light emitting element and being in contact with the first side surface, and the second conductive region being connected to the second electrode of the semiconductor light emitting element and being in contact with the first side surface;
• an output terminal including a third conductive region and a fourth conductive region, the third conductive region being connected to the first electrode of the semiconductor light receiving element and being in contact with the second side surface, and the fourth conductive region being connected to the second electrode of the semiconductor light receiving element and being in contact with the second side surface;
• a resin molded body provided on the upper surface of the insulating substrate, the input terminal, the output terminal, the semiconductor light receiving element, and the semiconductor light emitting element;
• and
• an antistripping material bonding a lower surface of the resin molded body to the input terminal and the lower surface of the resin molded body to the output terminal, a part of the first conductive region adjacent to the first side surface being bonded to the resin molded body, a part of the second conductive region adjacent to the first side surface being bonded to the resin molded body, a part of the third conductive region adjacent to the second side surface being bonded to the resin molded body, a part of the fourth conductive region adjacent to the second side surface being bonded to the resin molded body.