Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYasunori Iwatsu, Hirofumi Kawai
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYasunori Iwatsu, Hirofumi Kawai
Estimating the term…
A semiconductor device includes a first semiconductor layer of a first conductivity type, a first element including a second semiconductor layer of a second conductivity type, a second element including a third semiconductor layer of the second conductivity type, a first conductive member disposed in the first semiconductor layer between the first element and the second element, and a first semiconductor region of the second conductivity type provided inside the first semiconductor layer and contacting the first conductive member. A portion of the first element and a portion of the second element are formed in an upper layer portion of the first semiconductor layer. An upper end of the first conductive member is positioned higher than an upper end of the second semiconductor layer. A lower end of the first conductive member is positioned lower than lower ends of the second and third semiconductor layers.
A semiconductor device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.