Semiconductor device and manufacturing method thereof
AssigneeFuji Electric Co., Ltd.
InventorsKaname MITSUZUKA, Misaki TAKAHASHI, Tohru SHIRAKAWA
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AssigneeFuji Electric Co., Ltd.
InventorsKaname MITSUZUKA, Misaki TAKAHASHI, Tohru SHIRAKAWA
Estimating the term…
To provide a semiconductor device having excellent conduction characteristics of a transistor portion and a diode portion. The semiconductor device having a transistor portion and a diode portion, the semiconductor device includes: a drift region of a first conductivity type provided on a semiconductor substrate, a first well region of a second conductivity type provided on an upper surface side of the semiconductor substrate, an anode region of the second conductivity provided on the upper surface side of the semiconductor substrate, in the diode portion, and a first high concentration region of a second conductivity type which is provided in contact with a first well region between the anode region and the first well region, and has a higher doping concentration than the anode region.
A semiconductor device having a transistor portion and a diode portion, the semiconductor device comprising:
A manufacturing method of a semiconductor device having a transistor portion and a diode portion, the method comprising:
Dependencies are inferred from the claim text.