Vertical fin field effect transistor with a reduced gate-to-bottom source/drain parasitic capacitance
AssigneeInternational Business Machines Corporation
InventorsChen Zhang, Kangguo Cheng, Xin Miao, Wenyu Xu
Life of this patent
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AssigneeInternational Business Machines Corporation
InventorsChen Zhang, Kangguo Cheng, Xin Miao, Wenyu Xu
Estimating the term…
A method of forming a vertical fin field effect device is provided. The method includes, forming a vertical fin on a substrate, forming a masking block on the vertical fin, wherein the masking block extends a distance outward from the vertical fin sidewalls and endwalls, and a portion of the substrate surrounding the masking block is exposed. The method further includes removing at least a portion of the exposed portion of the substrate to form a recess and a fin mesa below the vertical fin, removing a portion of the fin mesa to form an undercut recess below an overhanging portion of the masking block, forming a spacer layer on the masking block and in the undercut recess, and removing a portion of the spacer layer to form an undercut spacer in the undercut recess.
A vertical fin field effect device, comprising:
A vertical fin field effect device, comprising:
A pair of vertical fin field effect devices, comprising:
Dependencies are inferred from the claim text.