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US 2020/0091306 A1Published application
Electronic device and method of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJinseong Heo, Yunseong Lee, Sanghyun Jo, Keunwook Shin, Hyeonjin Shin
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Abstract
Provided are electronic devices and methods of manufacturing the same. An electronic device may include a substrate, a gate electrode on the substrate, a ferroelectric layer between the substrate and the gate electrode, and a carbon layer between the substrate and the ferroelectric layer. The carbon layer may have an sp2 bonding structure.
Claims25
An electronic device comprising:
- a substrate;
- a gate electrode on the substrate;
- a ferroelectric layer between the substrate and the gate electrode;
- and
- a carbon layer between the substrate and the ferroelectric layer, the carbon layer having an sp2 bonding structure.
2 more elements
A method of manufacturing an electronic device, the method comprising:
- preparing a substrate including a channel element;
- depositing a carbon layer on the channel element, the carbon layer having an sp2 bonding structure;
- depositing a ferroelectric layer on the carbon layer;
- depositing a gate electrode on the ferroelectric layer;
- and
- crystallizing the ferroelectric layer through an annealing process.
3 more elements
An electronic device comprising:
- a channel element;
- a source and a drain connected to opposite ends of the channel element;
- a gate electrode on the channel element, the gate electrode spaced apart from the source, drain, and channel element;
- a ferroelectric layer between the channel element and the gate electrode;
- and
- a carbon layer between the channel element and the ferroelectric layer,
- the carbon layer configured to limit diffusion of at least one of metal or oxygen from the ferroelectric layer into the channel element.
4 more elements
Dependencies are inferred from the claim text.