Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorYoichi Hori
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorYoichi Hori
Estimating the term…
A semiconductor device of an embodiment includes a silicon carbide layer having a first plane and a second plane; a first silicon carbide region of a first conductivity type in the silicon carbide layer; a second silicon carbide region of a second conductivity type between the first silicon carbide region and the first plane; a third silicon carbide region of the second conductivity type between the first silicon carbide region and the first plane, the third silicon carbide region extending in a first direction parallel to the first plane; a first electrode provided on a side of the first plane; a second electrode provided on a side of the second plane; and a metal silicide layer provided between the first electrode and the second silicon carbide region, the metal silicide layer having a portion being in contact with the first plane, and a shape of the portion being an octagon.
A semiconductor device comprising:
Dependencies are inferred from the claim text.