Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsMakoto Mizukami, Masaru Furukawa, Teruyuki Ohashi
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsMakoto Mizukami, Masaru Furukawa, Teruyuki Ohashi
Estimating the term…
A semiconductor device according to an embodiment includes a silicon carbide layer having first and second planes; a first silicon carbide region; second and third silicon carbide regions between the first silicon carbide region and the first plane; a fourth silicon carbide region between the second silicon carbide region and the first plane; a first and second gate electrodes; a suicide layer on the fourth silicon carbide region; a first electrode on the first plane having a first portion and a second portion, the first portion being in contact with the first silicon carbide region, the second portion being in contact with the suicide layer; a second electrode on the second plane; and an insulating layer between the first portion and the second portion having a first side surface and a second side surface, an angle of the first side surface being smaller than that of the second side surface.
A semiconductor device comprising:
Dependencies are inferred from the claim text.