Solid-state imaging device and electronic apparatus

An electronic apparatus comprising

• a solid-state imaging device that electronically shoots an image of an object to be observed,
• the solid-state imaging device including
• a first substrate including a first semiconductor substrate and a first multi-layered wiring layer stacked on the first semiconductor substrate, the first semiconductor substrate having a pixel unit formed thereon, the pixel unit having pixels arranged thereon,
• a second substrate including a second semiconductor substrate and a second multi-layered wiring layer stacked on the second semiconductor substrate, the second semiconductor substrate having a circuit formed thereon, the circuit having a predetermined function, and
• a third substrate including a third semiconductor substrate and a third multi-layered wiring layer stacked on the third semiconductor substrate, the third semiconductor substrate having a circuit formed thereon, the circuit having a predetermined function,
• the first substrate, the second substrate, and the third substrate being stacked in this order,
• the first substrate and the second substrate being bonded together in a manner that the first multi-layered wiring layer and the second semiconductor substrate are opposed to each other,
• the solid-state imaging device including a first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate to each other,
• the first coupling structure including a via having a structure in which an electrically-conductive material is embedded in one through hole provided by penetrating at least the first substrate from a back surface side of the first substrate, or a structure in which a film including an electrically-conductive material is formed on an inner wall of the through hole, the via electrically coupling a predetermined wiring line in the first multi-layered wiring layer, and a predetermined wiring line in the second multi-layered wiring layer or a predetermined wiring line in the third multi-layered wiring layer to each other.