Solid state imaging device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsHayato Nasu, Yasushi Itabashi
Life of this patent
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Abstract
According to one embodiment, the interconnect layers include a first interconnect layer and a second interconnect layer. The second interconnect layer is provided on the first interconnect layer. The insulating layer is provided between the plurality of interconnect layers. The barrier metal film is provided at a surface of the first interconnect layer but not provided at a surface of the second interconnect layer. The plugs connect the first interconnect layer and the second interconnect layer, and are provided between the first interconnect layer and the second interconnect layer. The plugs are arranged at a spacing of 200 μm or less along a longitudinal direction of the second interconnect layer.
Claims12
A solid state imaging device, comprising:
- a substrate;
- a pixel provided at a surface of the substrate;
- a plurality of interconnect layers provided on the substrate, the plurality of interconnect layers including a first interconnect layer and a second interconnect layer, the second interconnect layer being provided on the first interconnect layer;
- an insulating layer provided between the plurality of interconnect layers;
- a barrier metal film provided at a surface of the first interconnect layer but not provided at a surface of the second interconnect layer;
- and
- a plurality of plugs connecting the first interconnect layer and the second interconnect layer, and being provided between the first interconnect layer and the second interconnect layer,
- the plurality of plugs being arranged at a spacing of 200 μm or less along a longitudinal direction of the second interconnect layer.
A solid state imaging device, comprising:
- a substrate;
- a pixel provided at a surface of the substrate;
- at least one layer of an interconnect layer provided on the substrate, a barrier metal film not being provided at a surface of the interconnect layer;
- a plurality of metal layers provided under the interconnect layer;
- an insulating layer provided between the interconnect layer and the metal layers;
- and
- a plurality of plugs connecting the interconnect layer and the metal layers, and being provided between the interconnect layer and the metal layers,
- the metal layers being provided in island configurations inside the insulating layer.
Dependencies are inferred from the claim text.