Back to results
US 2020/0091187 A1Published application
Semiconductor device and manufacturing method of the same
AssigneeSK hynix Inc.
InventorNam Jae LEE
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a semiconductor device having improved structural stability and a method of manufacturing such a semiconductor device. The semiconductor device includes a first stacked structure and a second stacked structure. The semiconductor device further includes a first support including a first upper pillar passing through the second stacked structure and including at least two first lower pillars extending from the first upper pillar and passing through the first stacked structure.
Claims14
A semiconductor device, comprising:
- a first stacked structure including first interlayer insulating layers and first conductive patterns stacked alternately with each other in a first direction;
- a second stacked structure including second interlayer insulating layers and second conductive patterns stacked alternately with each other in the first direction and arranged over the first stacked structure;
- and
- a first support including a first upper pillar passing through the second stacked structure and including at least two first lower pillars passing through the first stacked structure,
- wherein the first upper pillar extends from the at least two first lower pillars in the first direction.
2 more elements
Dependencies are inferred from the claim text.