Semiconductor memory device
AssigneeToshiba Memory Corporation
InventorsTsukasa TOKUTOMI, Masanobu Shirakawa, Takuya Futatsuyama
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AssigneeToshiba Memory Corporation
InventorsTsukasa TOKUTOMI, Masanobu Shirakawa, Takuya Futatsuyama
Estimating the term…
According to one embodiment, a semiconductor memory device includes: first and second memory cells; a first and second word lines; and a first bit line. The device is configured to execute first to sixth operations. In the first operation, a first voltage is applied to the first word line and a second voltage is applied to a semiconductor layer. In the second operation, the first voltage is applied to the second word line. In the third operation, a third voltage is applied to the first word line. In the fourth operation, the third voltage is applied to the second word line. In the fifth operation, a fourth voltage is applied to the first word line. In the sixth operation, the fourth voltage is applied to the second word line.
A semiconductor memory device comprising:
Dependencies are inferred from the claim text.