Semiconductor device and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuo-Cheng CHING, Kuan-Ting PAN, Shi-Ning JU, Kuan-Lun CHENG, Chih-Hao WANG
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsKuo-Cheng CHING, Kuan-Ting PAN, Shi-Ning JU, Kuan-Lun CHENG, Chih-Hao WANG
Estimating the term…
A semiconductor device has a substrate, a first dielectric fin, and an isolation structure. The substrate has a first semiconductor fin. The first dielectric fin is disposed over the substrate and in contact with a first sidewall of the first semiconductor fin, in which a width of the first semiconductor fin is substantially equal to a width of the first dielectric fin. The isolation structure is in contact with the first semiconductor fin and the first dielectric fin, in which a top surface of the isolation structure is in a position lower than a top surface of the first semiconductor fin and a top surface of the first dielectric fin.
A semiconductor device, comprising:
10-20. (canceled)
A semiconductor device, comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.