Semiconductor unit, semiconductor module, and semiconductor device

A semiconductor unit, comprising:

• a plurality of transistor chips arranged in a plurality of parallel rows each extending in a first direction, each transistor chip respectively having a first main electrode on a bottom surface and a second main electrode on a top surface;
• a first conductor layer under the plurality transistor chips so as to be in contact with and electrically connected to the first main electrodes of the transistor chips, a first conductor layer having a terminal region on which a first external terminal vertically extending upwards is provided, the terminal region extending from one end of at least one of the parallels rows of the transistors in a plan view so as to provide a current path generally parallel to the first direction between the first external terminal and the first main electrodes of the row of the transistors from which the terminal region extends;
• a second conductor layer disposed in a same plane as the first conductor layer, the second conductor layer being arranged adjacent to the terminal region of the first conductor layer at a position that is generally aligned with the terminal region of the first conductor layer in a second direction perpendicular to the first direction, the second conductor layer having a second external terminal and a conductive post thereon both vertically extending upwards;
• and
• a wiring substrate above the plurality of transistor chips, including a wiring layer electrically connected to each of the second main electrodes of the plurality of transistor chips, the wiring substrate laterally extending to a region above the second conductor layer and the wiring layer being in contact with and electrically connected to the second conductor layer via the conductive post.