Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsMorio IWAMIZU, Shigeyuki Takeuchi
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Abstract
Provided is a semiconductor device capable of reducing a mounting area. A semiconductor device (100) includes a semiconductor element (50) and a control element (150) arranged on a front surface (50a) of the semiconductor element (50). The semiconductor element (50) includes a semiconductor substrate (SB) including a first region AR1 and a second region AR2 adjacent to each other, a first MOS transistor (Tr1) provided is the first region (AR1), and a second MOS transistor (Tr2) provided in the second region (AR2). A first drain region (3a) of the first MOS transistor (Tr1) is connected to a second drain region (3b) of the second MOS transistor (Tr2). The control element (150) turns on and off the first MOS transistor (Tr1) and the second MOS transistor (Tr2).
Claims19
A semiconductor device comprising:
- a semiconductor element;
- and
- a control element arranged on one surface of the semiconductor element, wherein,
- the semiconductor element includes a semiconductor substrate including a first region and a second region adjacent to each other, a first transistor provided in the first region, and a second transistor provided in the second region, and
- a first drain region of the first transistor is connected to a second drain region of the second transistor, and the control element is configured to turn on and off the first transistor and the second transistor.
Dependencies are inferred from the claim text.