Semiconductor package

A semiconductor package comprising:

• a first package component comprising a first side, a second side opposite to the first side, and a recessed corner at the first side;
• a first stress buffer structure disposed at the recessed corner;
• a second package component connected to the first side of the first package component;
• and
• an underfill material between the first package component and the second package component,
• wherein the first stress buffer structure has a first surface in contact with the first package component and a second surface coupled to the first surface and in contact with the underfill material.

A semiconductor package comprising:

• a first package component comprising a first side, a second side opposite to the first side, a recessed corner at the first side, and a recessed edge coupled to the recessed corner at the first side;
• a first stress buffer structure disposed at the recessed corner;
• a second stress buffer structure disposed at the recessed edge;
• a second package component connected to the first side of the first package component;
• a plurality of connectors disposed between the first package component and the second package component, and the connectors electrically coupling the first package component and the second package component;
• and
• an underfill material between the first package component and the second package component,
• wherein the first stress buffer structure and the second stress buffer structure are disposed between the underfill material and the first package component.