Semiconductor module

A semiconductor module, comprising:

• a first circuit substrate having an insulating plate and a conductive layer disposed on the insulating plate;
• a plurality of semiconductor elements on the conductive layer, the semiconductor elements each having a control electrode and a first main electrode on an upper surface thereof and a second main electrode on a bottom surface thereof, the second main electrode being in contact with and electrically connected to the conductive layer;
• a second circuit substrate disposed above the semiconductor elements, the second circuit substrate having an insulating layer, a main current wiring layer embedded in the insulating layer, and a control wiring layer embedded in the insulating layer, the control wiring layer being positioned in a layer above the main current wiring layer;
• main current pins connecting each of the first main electrodes and the main current wiring layer;
• control pins connecting each of the control electrodes and the control wiring layer;
• a first lead terminal vertically extending upwards from and in contact with the main current wiring layer of the second circuit substrate;
• a second lead terminal vertically extending upwards from and in contact with the conductive layer of the first circuit substrate;
• a third lead terminal vertically extending upwards from and in contact with the control wiring layer of the second circuit substrate;
• and
• a sealing material covering at least an upper surface of the first circuit substrate, side surfaces and the upper surfaces of the semiconductor elements, and a lower surface of the second circuit substrate.