Microelectronic assemblies

A computing device, comprising:

• a microelectronic assembly, comprising:
• a package substrate having a first surface and an opposing second surface;
• a first die having a first surface and an opposing second surface, wherein the first surface of the first die is coupled to the second surface of the package substrate;
• a second die having a first surface and an opposing second surface, wherein the first surface of the second die at least partially overlaps the second surface of the first die, and wherein the first surface of the second die is coupled to the second surface of the package substrate by a conductive pillar;
• and
• a shield structure, wherein the shield structure at least partially surrounds the conductive pillar.

A microelectronic assembly, comprising:

• a package substrate having a first surface and an opposing second surface;
• a first die having a first surface and an opposing second surface, wherein the first die is embedded in a first dielectric layer, wherein the first dielectric layer is between a second dielectric layer and the second surface of the package substrate, and wherein the first surface of the first die is coupled to the second surface of the package substrate;
• a second die having a first surface and an opposing second surface, wherein the second die is embedded in the second dielectric layer, and wherein the second dielectric layer is between the first dielectric layer and a third dielectric layer;
• a third die having a first surface and an opposing second surface, wherein the third die is embedded in the third dielectric layer, wherein the first surface of the third die is coupled to the second surface of the package substrate by a first conductive pillar, and wherein the first surface of the third die is coupled to the second surface of the second die by a second conductive pillar;
• and
• a shield structure, wherein the shield structure surrounds the first conductive pillar.