Package structure and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYu-Kuang Liao, Cheng-Chun Tsai, Chen-Hua Yu, Fang-Cheng Chen, Wen-Chih Chiou, Ping-Jung Wu
Life of this patent
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Abstract
A package structure including a plurality of first dies and an insulating encapsulant is provided. The plurality of first dies each include a first waveguide layer having a first waveguide path of a bent pattern, wherein the first waveguide layers of the plurality of first dies are optically coupled to each other to form an optical route. The insulating encapsulant encapsulates the plurality of first dies.
Claims20
A package structure, comprising:
- a plurality of first dies, each comprising a first waveguide layer having a first waveguide path of a bent pattern, wherein the first waveguide layers of the plurality of first dies are optically coupled to each other to form an optical route;
- and
- an insulating encapsulant, encapsulating the plurality of first dies.
The package structure as claimed in claim 6, further comprising memory devices encapsulating in the insulating encapsulant, wherein each of the memory devices is located on and electrically connected to a respective one of the semiconductor chips.
A package structure, comprising:
- a plurality of first dies, each comprising a first waveguide layer having a first bent waveguide path, wherein the first waveguide layers of the plurality of first dies are optically coupled to each other;
- a plurality of second dies, each comprising a second waveguide layer having a second straight waveguide path, wherein the second waveguide layers of the plurality of second dies are optically coupled to each other, wherein the first waveguide layers of the plurality of first dies and the second waveguide layers of the plurality of second dies are optically coupled to form an optical route;
- and
- a redistribution circuit structure, located on and electrically connecting the plurality of first dies and the plurality of second dies.
A manufacturing method of a package structure, comprising:
- providing a semiconductor substrate;
- forming a plurality of first dies and a plurality of second dies, each of the plurality of first dies comprising a first waveguide layer, and each of the plurality of second dies comprising a second waveguide layer;
- disposing the plurality of first dies and the plurality of second dies on the semiconductor substrate through hybrid bonding, the first waveguide layers of the plurality of first dies and the second waveguide layers of the plurality of second dies being optically coupled to each other to form an optical route;
- encapsulating the plurality of first dies and the plurality of second dies in an insulating material;
- forming a redistribution circuit structure on the insulating material, the redistribution circuit structure electrically connected to the plurality of first dies and the plurality of second dies;
- and
- forming conductive elements over the redistribution circuit structure.
Dependencies are inferred from the claim text.