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US 2020/0091120 A1Published application
Semiconductor module, display device, and semiconductor module manufacturing method
AssigneeSharp Kabushiki Kaisha
InventorHIROYOSHI HIGASHISAKA
Life of this patent
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Abstract
Resin covers a side surface and a back surface of a blue LED and holds the blue LED level. An electrode is disposed between a top surface of a wiring substrate and a back surface of the blue LED, extends through the resin, and electrically connects the wiring substrate and the blue LED to each other. A light-outgoing surface (top-surface) of the blue LED is exposed without being covered with the resin, and the light-outgoing surface (top-surface) is flush with a top surface of the resin.
Claims20
A semiconductor module, comprising:
- a substrate;
- a light-emitting chip mounted on the substrate;
- a resin covering a side surface and a back surface of the light-emitting chip and holding the light-emitting chip level;
- and
- an electrode member disposed between a top surface of the substrate and the back surface of the light-emitting chip, penetrating through the resin, and electrically connecting the substrate and the light-emitting chip to each other,
- wherein a light-emerging surface (top surface) of the light-emitting chip is exposed from the resin, and
- wherein the light-emerging surface (top surface) and a top surface of the resin are arranged on the same plane.
4 more elements
A semiconductor module, comprising:
- a substrate;
- a plurality of light-emitting chips juxtaposed on the substrate;
- a resin covering side surfaces and back surfaces of the plurality of light-emitting chips and holding the plurality of light-emitting chips level;
- and
- an electrode members disposed between a top surface of the substrate and the back surfaces of the plurality of light-emitting chips, respectively, penetrating through the resin, and electrically connecting the substrate and the plurality of light-emitting chips to each other,
- wherein light-outgoing surfaces (top surfaces) of the plurality of light-emitting chips are exposed from the resin, and
- wherein the light-outgoing surfaces (top surfaces) and a top surface of the resin are arranged on the same plane.
4 more elements
Dependencies are inferred from the claim text.