Semicondcutor package and manufacturing method of semicondcutor package

A semiconductor package, comprising:

• a lower semiconductor device;
• a plurality of conductive pillars disposed on the lower semiconductor device along a direction parallel to a side of the lower semiconductor device, wherein a gap between adjacent two of the plurality of the conductive pillars is substantially greater than a gap between any other adjacent two of the plurality of the conductive pillars;
• an upper semiconductor device disposed on the lower semiconductor device and revealing a portion of the lower semiconductor device where the plurality of conductive pillars are disposed;
• an encapsulating material encapsulating the lower semiconductor device, the plurality of conductive pillars, and the upper semiconductor device;
• and
• a redistribution structure disposed over and electrically connected to the upper semiconductor device and the plurality of conductive pillars.

A manufacturing method of a semiconductor package, comprising:

• providing at least one lower semiconductor device;
• forming a plurality of conductive pillars on the at least one lower semiconductor device;
• disposing a dummy die on a side of the at least one lower semiconductor device;
• disposing an upper semiconductor device on the at least one lower semiconductor device and the dummy die, wherein the upper semiconductor device reveals a portion of the at least one lower semiconductor device where the plurality of conductive pillars are disposed;
• encapsulating the at least one lower semiconductor device, the dummy die, the upper semiconductor device, and the plurality of conductive pillars in an encapsulating material;
• and
• forming a redistribution structure over the upper semiconductor device and the plurality of conductive pillars.