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US 2020/0091112 A1Published application
Stack packages including stacked semiconductor dies
AssigneeSK hynix Inc.
InventorEun Hye DO
Life of this patent
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Abstract
A stack package includes a second semiconductor die stacked on the first semiconductor die, a third semiconductor die disposed on the lifting supporter. The third semiconductor die vertically and partially overlapping with the second semiconductor die.
Claims20
A stack package comprising:
- a first semiconductor die disposed on a package substrate;
- a second semiconductor die stacked on the first semiconductor die;
- a lifting supporter disposed on the package substrate to be laterally spaced apart from the second semiconductor die;
- a third semiconductor die disposed on both the second semiconductor die and the lifting supporter;
- and
- a fourth semiconductor die stacked on the third semiconductor die.
3 more elements
A stack package comprising:
- a first semiconductor die disposed on a package substrate to include first bonding pads;
- a second semiconductor die vertically stacked on the first semiconductor die to include second bonding pads;
- first bonding wires electrically connecting the first bonding pads to the package substrate;
- a first adhesive layer disposed between the first and second semiconductor dies to raise the second semiconductor die and the first adhesive layer expanding to cover the first bonding pads and portions of the first bonding wires bonded to the first bonding pads;
- a third semiconductor die having an edge region that is stacked on an edge region of the second semiconductor die to vertically overlap with the edge region of the second semiconductor die and including third bonding pads disposed on a body of the third semiconductor die;
- a fourth semiconductor die vertically stacked on the third semiconductor die to include fourth bonding pads;
- third bonding wires electrically connecting the third bonding pads to the package substrate;
- a second adhesive layer disposed between the third and fourth semiconductor dies to raise the fourth semiconductor die and expanding to cover the third bonding pads and portions of the third bonding wires bonded to the third bonding pads;
- and
- a lifting supporter disposed between the third semiconductor die and the package substrate to raise the third semiconductor die.
7 more elements
A stack package comprising:
- a stack structure having a width comprising:
- a first stack structure including first and second semiconductor dies that are stacked with each other and having a second width;
- and
- a second stack structure including third and fourth semiconductor dies that are stacked with each other and having a third width,
- wherein the first and second stack structures vertically overlap with each other by a first width to provide the width of the stack structure which is the sum of the first and second widths less the third width.
2 more elements
Dependencies are inferred from the claim text.