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US 2020/0091109 A1Published application
Method for manufacturing electronic package
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsYu-Min Lo, Chee-Key Chung, Chang-Fu Lin, Kuo-Hua Yu, Hsiang-Hua Huang
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Abstract
The present disclosure provides a method for manufacturing an electronic package, with an electronic component bonded to a carrier structure by means of solder tips formed on conductive bumps, wherein the solder tips do not require a reflow process to be in contact with the carrier structure, thereby allowing the conductive bumps to have an adequate amount of solder tips formed thereon and thus precluding problems such as cracking and collapsing of the solder tips.
Claims14
A method for manufacturing an electronic package, comprising:
- providing an electronic component and a carrier structure, with a plurality of conductive bumps formed on the electronic component and a solder tip formed on each of the conductive bumps;
- and
- bonding the electronic component to the carrier structure via the solder tips with the solder tips being brought into contact with the carrier structure and free from going through a reflow process.
(canceled)
Dependencies are inferred from the claim text.