Multilayer wiring board, electronic device and method for producing multilayer wiring board
AssigneeMurata Manufacturing Co., Ltd.
InventorsRyosuke TAKADA, Toshitaka HAYASHI, Hiromasa KOYAMA
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Abstract
A multilayer wiring board includes a first insulating layer, a second insulating layer stacked on the first insulating layer, a via conductor inside each of the first insulating layer and the second insulating layer, and a conductive bonding layer that bonds the via conductors to each other. The first insulating layer is directly bonded to the second insulating layer, and a relationship a1>b1 is satisfied, where a1 is a maximum diameter of the bonding layer and b1 is a maximum diameter of the via conductor at an interface with the bonding layer.
Claims30
A multilayer wiring board comprising:
- a first insulating layer;
- a second insulating layer stacked on the first insulating layer;
- a via conductor inside each of the first insulating layer and the second insulating layer;
- and
- a conductive bonding layer to bond the via conductors to each other;
- wherein
- the first insulating layer is directly bonded to the second insulating layer;
- a relationship a1>b1 is satisfied, where a1 is a maximum diameter of the bonding layer and b1 is a maximum diameter of the via conductor at an interface with the bonding layer;
- and
- the via conductor has a metal content of about 99 wt % or more.
A multilayer wiring board comprising:
- a first insulating layer;
- a third insulating layer stacked on the first insulating layer;
- a conductive wiring layer on a surface of the first insulating layer on a side facing the third insulating layer;
- a via conductor inside the third insulating layer;
- and
- a conductive bonding layer to bond the conductive wiring layer to the via conductor;
- wherein
- the first insulating layer is directly bonded to the third insulating layer;
- a relationship a2>b2 is satisfied, where a2 is a maximum diameter of the bonding layer, and b2 is a maximum diameter of the via conductor at an interface with the bonding layer;
- and
- the via conductor has a metal content of about 99 wt % or more.
Dependencies are inferred from the claim text.