Semiconductor package and manufacturing method thereof
AssigneePowertech Technology Inc.
InventorsShang-Yu Chang Chien, Hung-Hsin Hsu, Nan-Chun Lin
Life of this patent
Estimating the term…
Abstract
A package structure including a semiconductor die, an insulating encapsulant, a dielectric layer, and a redistribution layer is provided. The semiconductor die has an active surface, a back surface opposite to the active surface, and a plurality of conductive bumps disposed on the active surface. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer is disposed on the he insulating encapsulant and electrically connected to the plurality of conductive bumps. The dielectric layer is disposed between the insulating encapsulant and the redistribution layer, wherein the dielectric layer encapsulates at least a portion of each of the plurality of conductive bumps.
Claims20
A package structure, comprising:
- a semiconductor die having an active surface, a back surface opposite to the active surface, and a plurality of conductive bumps disposed on the active surface;
- an insulating encapsulant encapsulating the semiconductor die;
- a redistribution layer disposed on the insulating encapsulant and electrically connected to the plurality of conductive bumps;
- and
- a dielectric layer disposed between the insulating encapsulant and the redistribution layer, wherein the dielectric layer encapsulates at least a portion of each of the plurality of conductive bumps.
A manufacturing method of a package structure, comprising:
- providing a carrier;
- forming an adhesive layer on the carrier;
- bonding a semiconductor die on the adhesive layer, wherein the semiconductor die has an active surface, a back surface opposite to the active surface, and a plurality of conductive bumps disposed on the active surface, and the semiconductor die is bonded on the adhesive layer in a face-down manner such that the plurality of conductive bumps is facing the adhesive layer;
- forming an insulating encapsulant on the adhesive layer and encapsulating the semiconductor die;
- de-bonding the carrier by separating the adhesive layer from the semiconductor die and the insulating encapsulant;
- forming a dielectric layer covering the active surface of the semiconductor die, and covering the insulating encapsulant, wherein the dielectric layer encapsulates at least a portion of each of the plurality of conductive bumps;
- and
- forming a redistribution layer on the dielectric layer and the semiconductor die, wherein the redistribution layer is electrically connected to the plurality of conductive bumps.
Dependencies are inferred from the claim text.