Semiconductor package

A semiconductor package, comprising:

• a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposite to the active surface, and including a passivation film disposed on the active surface and having a first opening exposing at least a portion of the connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening;
• an encapsulant covering at least a portion of the semiconductor chip;
• and
• a connection structure including an insulating layer disposed on the protective film, and having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer disposed on the insulating layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening,
• wherein the second opening and the via hole are connected to have a stepped portion.