Package structure and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTuan-Yu Hung, Hung-Jui Kuo, Hsin-Yu Pan, Ming-che Ho, Tzu Yun Huang, Yen-Fu Su
Life of this patent
Estimating the term…
Abstract
A package structure is provided. The package structure includes a dielectric layer on a die, a RDL structure and a conductive terminal. The RDL structure comprises a redistribution layer in and on the dielectric layer. The redistribution layer comprises a via and a conductive plate. The via is located in and penetrating through the dielectric layer to be connected to the die. The conductive plate is on the via and the dielectric layer, and is connected to the die through the via. The conductive terminal is electrically connected to the die through the RDL structure. The via is ring-shaped.
Claims20
A package structure, comprising:
- a die;
- a dielectric layer on the die;
- an RDL structure comprising a redistribution layer in and on the dielectric layer, wherein the redistribution layer comprises:
- a via located in and penetrating through the dielectric layer to be connected to the die, wherein the via is ring-shaped;
- and
- a conductive plate on the via and the dielectric layer, and is connected to the die through the via;
- and
- a conductive terminal, electrically connected to the die through the RDL structure,
- wherein the dielectric layer comprises a first portion enclosed by an inner sidewall of the via and in physical contact with the die.
A package structure, comprising:
- a die;
- an RDL structure electrically connecting to the die, wherein the RDL structure comprises:
- a first redistribution layer having a first via and a first conductive plate, the first via penetrates through a first dielectric layer to connect to the die, and the first conductive plate is on the first via and the first dielectric layer, wherein the first via is a curved line;
- and
- a conductive terminal, electrically connected to the die through the RDL structure,
- wherein the first dielectric layer comprises a first portion surrounded by an inner sidewall of the first via and in physical contact with the die.
A method of forming a package structure, comprising:
- providing a die;
- forming a dielectric layer on the die;
- forming an RDL structure comprising a redistribution layer in and on the dielectric layer, comprising:
- patterning the dielectric layer to form a via hole penetrating through the dielectric layer, wherein the via hole is ring-shaped;
- forming a via in the via hole of the dielectric layer, the via is connected to the die, wherein the dielectric layer comprises a first portion enclosed by an inner sidewall of the via and in physical contact with the die;
- and
- forming a conductive plate on the via and the dielectric layer, the conductive plate is connected to the die through the via;
- and
- forming a conductive terminal, electrically connected to the die through the RDL structure.
Dependencies are inferred from the claim text.