Antenna module
AssigneeSamsung Electronics Co., Ltd.
InventorsHyung Mi JUNG, Kyoung Ok JUNG, Guk Hee JUNG
Life of this patent
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Abstract
An antenna module includes an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface, and a semiconductor package including a semiconductor chip, having an inactive surface and an active surface, on which a connection pad is disposed, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure to each other.
Claims16
An antenna module comprising:
- an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, and a wiring structure connected to the antenna pattern and extending to the second surface;
- and
- a semiconductor package including a semiconductor chip, having an active surface, on which a connection pad is disposed, and an inactive surface disposed on the second surface of the glass substrate and opposing the active surface, an encapsulant encapsulating the semiconductor chip, a connection member including a redistribution layer connected to the connection pad, and a through-via penetrating the encapsulant and connecting the redistribution layer and the wiring structure of the antenna substrate to each other.
An antenna module comprising:
- an antenna substrate including a glass substrate having first and second surfaces opposing each other, an antenna pattern disposed on the first surface, a wiring pattern disposed on the second surface, and a first through-via connecting the antenna pattern and the wiring pattern to each other;
- and
- a semiconductor package disposed on the antenna substrate,
- wherein the semiconductor package comprises:
- a first connection structure disposed on the second surface of the glass substrate, and including a first redistribution layer connected to the wiring pattern;
- a semiconductor chip disposed on the first connection member, and including a connection pad connected to the first redistribution layer;
- an encapsulant disposed on the first connection member and encapsulating the semiconductor chip;
- a second connection member disposed on the encapsulant, and including a second redistribution layer, and
- a second through-via penetrating the encapsulant and connecting the first redistribution layer and the second redistribution layer to each other.
Dependencies are inferred from the claim text.