US 2020/0091094 A1 · INTEGRATED FILTER TECHNOLOGY WITH EMBEDDED DEVICES

Abstract

A filter including an insulating die having a plurality of MIM (Metal Insulator Metal) capacitors disposed within the die is disclosed. A 2.5D (2.5 Dimensional) inductor disposed within a redistribution layer (RDL) is electrically coupled to at least one of the plurality of MIM capacitors in the die. A 3D (3 Dimensional) inductor is disposed around the die and is electrically coupled to at least one of the plurality of MIM capacitors.

Claims30

Dependent claims

A filter comprising:

a die having a plurality of Metal Insulator Metal (MIM) capacitors disposed within the die;
a 2.5D (2.5 Dimensional) inductor disposed within a redistribution layer (RDL) and electrically coupled to at least one of the plurality of MIM capacitors;
and
a 3D (3 Dimensional) inductor, wherein the 3D inductor is disposed around the die and is electrically coupled to at least one of the plurality of MIM capacitors.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

16/132,323Filed 14 Sep 2018

Published

19 Mar 2020

Term ends

Not estimatedThe source records don’t support an estimate.

Classification21 codes

H10W 20/20
Interconnections in chips, wafers or substrates: interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
H10W 44/501
Electrical arrangements for controlling or matching impedance: inductive arrangements
H03H 3/02
For the manufacture of electromechanical resonators or networks: for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 3/08
For the manufacture of electromechanical resonators or networks: for the manufacture of resonators or networks using surface acoustic waves

Integrated filter technology with embedded devices

Life of this patent

Integrated filter technology with embedded devices

Life of this patent

Abstract

Claims30