Flexible shield for semiconductor devices and methods

An electronic device, comprising:

• a first device and a second device coupled to a surface of a substrate;
• a continuous flexible shield woven over the first device and under the second device to separate the first device from the second device;
• wherein the continuous flexible shield is electrically coupled to a ground source in the substrate;
• and
• wherein the second device is coupled to the substrate through one or more vias passing through the continuous flexible shield.

A method of forming an electronic device, comprising:

• forming a continuous flexible shield, including:
• removing portions of a dielectric layer covering a metal layer in a dielectric-metal-dielectric laminate;
• forming one or more holes through the dielectric-metal-dielectric laminate;
• forming a first conductive via within a first hole, wherein the first conductive via is electrically isolated from the metal layer in the dielectric-metal-dielectric laminate;
• forming a second conductive via within a second hole, wherein the second conductive via is electrically coupled to the metal layer in the dielectric-metal-dielectric laminate;
• weaving the continuous flexible shield over a first electronic device and under a second electronic device, the first and second electronic devices coupled to a substrate;
• coupling the second conductive via to a ground in the substrate;
• and
• coupling the second electronic device to the substrate through the first conductive via.