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US 2020/0091086 A1Published application
Alignment Mark Design for Packages
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLi-Hsien Huang, Hsien-Wei Chen, Ching-Wen Hsiao, Der-Chyang Yeh, Shin-Puu Jeng, Chen-Hua Yu
Life of this patent
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Abstract
A package includes a device die, a molding material molding the device die therein, a through-via penetrating through the molding material, and an alignment mark penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via.
Claims20
A method comprising:
- forming a first dielectric layer;
- performing a plating process to form an alignment mark over the first dielectric layer;
- placing a device die over the first dielectric layer, wherein the placing is performed using the alignment mark for aligning a position of the device die;
- encapsulating the alignment mark in an encapsulant;
- and
- forming a plurality of redistribution lines electrically connecting to the device die, wherein the plurality of redistribution lines are formed using the alignment mark for aligning positions.
3 more elements
A method comprising:
- forming a first redistribution line;
- forming an alignment mark over and electrically connecting to the first redistribution line, wherein the forming the alignment mark comprises plating;
- depositing a dielectric layer over the alignment mark;
- and
- forming a plurality of redistribution lines comprising first portions over the dielectric layer, and second portions extending into the dielectric layer, wherein the plurality of redistribution lines are formed using the alignment mark for aligning, and wherein at a time after the plurality of redistribution lines is formed, the alignment mark is fully covered by the dielectric layer.
2 more elements
A method comprising:
- forming an alignment mark;
- encapsulating a device die and the alignment mark in an encapsulant;
- forming a first dielectric layer over and contacting the device die and the alignment mark;
- and
- forming a plurality of redistribution lines over the encapsulant, with the alignment mark used for aligning positions of the plurality of redistribution lines, wherein the plurality of redistribution lines comprise a portion extending into the first dielectric layer to contact a top surface of a metal pillar in the device die, and after the plurality of redistribution lines are formed, the alignment mark is electrically floating.
2 more elements
Dependencies are inferred from the claim text.