Electronic device and manufacturing method thereof

A manufacturing method of an electronic device, comprising:

• forming an insulating encapsulant to encapsulate a multi-layered structure and a semiconductor die, wherein the multi-layered structure comprises a first conductor, a diffusion barrier layer formed on the first conductor, and a metallic layer formed on the diffusion barrier layer, and the insulating encapsulant at least exposes a portion of the semiconductor die and a portion of the first conductor of the multi-layered structure;
• forming a redistribution structure over the insulating encapsulant, the semiconductor die and the first conductor of the multi-layered structure;
• removing the metallic layer of the multi-layered structure to form a recess in the insulating encapsulant;
• and
• forming a second conductor in the recess over the diffusion barrier layer, wherein the first conductor, the diffusion barrier layer and the second conductor forms a conductive structure electrically coupled to the semiconductor die through the redistribution structure.