Embedded die packaging with integrated ceramic substrate

An integrated circuit (IC), comprising:

• a thermal transfer structure, including an electrically insulating, thermally conductive substrate with an electrically conductive feature;
• a semiconductor die mounted to the electrically conductive feature of the electrically insulating, thermally conductive substrate, the semiconductor die including electrically conductive contact structure, and an electronic component electrically connected to the electrically conductive contact structure;
• an electrically insulating lamination structure enclosing a portion of the semiconductor die and a portion of the thermal transfer structure;
• and
• a redistribution layer (RDL) structure with a conductive structure electrically connected to the electrically conductive contact structure.

A packaged electronic device, comprising:

• a thermal transfer structure, including an electrically insulating, thermally conductive substrate with an electrically conductive feature;
• a semiconductor die mounted to the electrically conductive feature of the electrically insulating, thermally conductive substrate, the semiconductor die including electrically conductive contact structure, and an electronic component electrically connected to the electrically conductive contact structure;
• and
• a redistribution layer (RDL) structure with a conductive structure electrically connected to the electrically conductive contact structure.

An integrated circuit (1C), comprising:

• a thermal transfer structure, including an electrically insulating, thermally conductive substrate with an electrically conductive feature;
• a semiconductor die mounted to the electrically conductive feature of the electrically insulating, thermally conductive substrate, the semiconductor die including an electrically conductive contact structure, and an electronic component electrically connected to the electrically conductive contact structure;
• and
• a frame, at least a portion of the semiconductor die positioned within a cavity in the frame