Pad Structure Design in Fan-Out Package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen
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Abstract
A package includes a corner, a device die, a plurality of redistribution lines underlying the device die, and a plurality of non-solder electrical connectors underlying and electrically coupled to the plurality of redistribution lines. The plurality of non-solder electrical connectors includes a corner electrical connector. The corner electrical connector is elongated. An electrical connector is farther away from the corner than the corner electrical connector, wherein the electrical connector is non-elongated.
Claims20
A package comprising:
- a plurality of dielectric layers;
- a plurality of redistribution lines in the plurality of dielectric layers;
- a first device die over and electrically coupling to the plurality of redistribution lines;
- a plurality of metal pads underlying and electrically coupling to the plurality of redistribution lines, wherein the plurality of metal pads comprises:
- a first inner metal pad, wherein the first inner metal pad is elongated;
- and
- a plurality of non-elongated metal pads surrounding the first inner metal pad;
- and
- a plurality of solder regions contacting the plurality of metal pads.
A package comprising:
- a device die;
- an encapsulant encapsulating the device die therein;
- a plurality of solder regions on a side of the device die, wherein some of the solder regions are electrically coupled to the device die;
- and
- a plurality of metal pads between the plurality of solder regions and the device die, wherein the plurality of metal pads are in contact with the plurality of metal pads, and wherein the plurality of metal pads comprise:
- a corner metal pad at a corner of the package;
- an inner elongated metal pad;
- and
- an inner non-elongated metal pad, wherein both of the inner elongated metal pad and the inner non-elongated metal pad are surrounded by other metal pads in the plurality of metal pads.
A package comprising:
- a device die;
- a plurality of redistribution lines electrically coupling to the device die;
- a plurality of metal pads, wherein some of the plurality of metal pads are electrically connected to the device die through the plurality of redistribution lines, and wherein the plurality of metal pads comprise:
- an elongated metal pad overlapped by the device die;
- and
- a plurality of inner non-elongated metal pads surrounding the elongated metal pad.
Dependencies are inferred from the claim text.